Layer Counts:

• Single & Double-Sided flex circuits
• Multilayer Flex Circuits (up to 12 layers)
• Rigid-flex circuits
• Single-Layer : IPC 6013, MIL-P-50884 – Type 1
• Double-Layer : IPC 6013, MIL-P-50884 – Type 2
• Multi-Layer : IPC 6013, MIL-P-50884 – Type 3
• Rigid-Flex : IPC 6013, MIL-P-50884 – Type 4
• Multi-Layer (not plated through) : IPC 6013, MIL-P-50884 – Type 5

Materials:

• Kapton, LPI, 94-VO
• Sputtered Copper on Kapton-thin film application
• FR-4 and Teflon

Cover/substrate: Polyimide film: 1 mil (25µm)*, 2 mil (50µm)*, 3 mil (75µm), 5 mil (125µm); Photoimageable Coverlay (PIC); Epoxy glass or polyimide glass (rigid-flex)

Conductor:

Copper: 1/8 oz. (5µm), 1/4 oz. (9µm), 1/3 oz. (12µm), 1/2 oz. (18µm)*, 1 oz. (35µm)*, 2 oz. (71µm), 3 oz. (107µm) Cupronickel: 0.625 mil (15µm), 0.9 mil (22µm), 1.3 mil (33µm), 1.9 mil (48µm), 2.3 mil (58µm)

Nickel: 2 mil (50µm), 5 mil (125µm)

Adhesive: Acrylic*, flame retardant, epoxy, epoxy prepreg, polyimide prepreg, phenolic

Stiffener: Epoxy-glass (FR-4), polyimide-glass, polyimide, copper, aluminum.

Quality:

• IPC-6013 Class 2
• ISO-9001:2000 Registered
• RoHS Compliant
• UL Certified (94-V0)
• Complete analytical capabilities

Value to our Customers:

• 100% Net List Electrical test
• JIT delivery
• Turn-key assembly
• Fast Turn Around:
  - Prototypes: 4 days
  - Production: 2 weeks

Technology:

• Wire bondable gold plating
• Soft/Hard gold plating
• PCI (Photoimageable Coverlay)
• Automatic and Hand Crafted assembly
• Laser cutting and skiving
• Turnkey packaging solutions
• Engineering design services