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CIRCOFLEX CAPABILITIES

Layer Counts:

  • Single & Double-Sided flex circuits
  • Multilayer Flex Circuits (up to 12 layers)
  • Rigid-flex circuits
  • Single-Layer : IPC 6013, MIL-P-50884 – Type 1
  • Double-Layer : IPC 6013, MIL-P-50884 – Type 2
  • Multi-Layer : IPC 6013, MIL-P-50884 – Type 3
  • Rigid-Flex : IPC 6013, MIL-P-50884 – Type 4
  • Multi-Layer (not plated through) : IPC 6013, MIL-P-50884 – Type 5

Materials:

  • Kapton, LPI, 94-VO
  • Sputtered Copper on Kapton-thin film application
  • FR-4 and Teflon


    • Cover/substrate: Polyimide film: 1 mil (25µm)*, 2 mil (50µm)*, 3 mil (75µm), 5 mil (125µm); Photoimageable Coverlay (PIC); Epoxy glass or polyimide glass (rigid-flex)

    Conductor:

    Copper: 1/8 oz. (5µm), 1/4 oz. (9µm), 1/3 oz. (12µm), 1/2 oz. (18µm)*, 1 oz. (35µm)*, 2 oz. (71µm), 3 oz. (107µm) Cupronickel: 0.625 mil (15µm), 0.9 mil (22µm), 1.3 mil (33µm), 1.9 mil (48µm), 2.3 mil (58µm)

    Nickel: 2 mil (50µm), 5 mil (125µm)

    Adhesive: Acrylic*, flame retardant, epoxy, epoxy prepreg, polyimide prepreg, phenolic

    Stiffener: Epoxy-glass (FR-4), polyimide-glass, polyimide, copper, aluminum.

    Quality:

    • IPC-6013 Class 2
    • ISO-9001:2000 Registered
    • RoHS Compliant
    • UL Certified (94-V0)
    • Complete analytical capabilities

    Value to our Customers:

    • 100% Net List Electrical test
    • JIT delivery
    • Turn-key assembly
    • Fast Turn Around:
      - Prototypes: 4 days
      - Production: 2 weeks

    Technology:

    • Wire bondable gold plating
    • Soft/Hard gold plating
    • PCI (Photoimageable Coverlay)
    • Automatic and Hand Crafted assembly
    • Laser cutting and skiving
    • Turnkey packaging solutions
    • Engineering design services